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2032010
Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
Mi-Song Kim, Chulmin Oh, Won Sik Hong
J Weld Join. 2019;37(2):15-20.   Published online April 19, 2019
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Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive
Ji-Yeon Park, Chulmin Oh, Deok-Hee Won, Won Sik Hong
J Weld Join. 2018;36(3):57-64.   Published online June 12, 2018
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2031937
Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate
Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung
J Weld Join. 2018;36(2):14-20.   Published online April 30, 2018
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Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(6):65-70.   Published online January 20, 2012
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The Bonding Strength Characteristic of the Filler Metal Powder on the TLP Bonded Region of Superalloy GTD-111DS
In-Seok Oh, Gil-Moo Kim, Byeong-Shik Moon
J Weld Join. 2007;25(5):45-50.   Published online December 3, 2007
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