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Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
J Weld Join. 2023;41(6):558-565.   Published online December 31, 2023
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Evaluation of SS 275 Substrate Substitutability in Arc and Wire Additive Manufacturing of Inconel 718
Tae Hyun Lee, Je Hoon Oh, Dong-Hyuck Kam
J Weld Join. 2019;37(1):62-68.   Published online January 25, 2019
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Study on Joint of Micro Solder Bump for Application of Flexible Electronics
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2013;31(3):4-10.   Published online June 30, 2013
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Interfacial Microstructures between Ag Wiring Layers and Various Substrates
Keun-Soo Kim, K. Suganuma, Seok-Hwan Huh
J Weld Join. 2011;29(5):90-94.   Published online November 22, 2011
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