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Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint: Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee; J Weld Join. 2016;34(1):26-34. Published online February 29, 2016; DOI: https://doi.org/10.5781/JWJ.2016.34.1.26
Cited By 6; Full text PubReader ePub PDF

Weld Quality Evaluation Method for the Resistance Spot Welds using X-ray Transmission Inspection: Jong-Dae Lee, So-Jeong Lee, Jung-Hwan Bang, Gil-Sang Yoon, Mok-Soon Kim, Jun-Ki Kim; J Weld Join. 2014;32(6):537-543. Published online December 31, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.6.1; PDF

Mechanical Behavior of Weldbond Joint of 1.2GPa Grade Ultra High Strength TRIP Steel for Car Body Applications: Jong-Dae Lee, So-Jeong Lee, Jung-Hwan Bang et al.; J Weld Join. 2014;32(5):474-479. Published online October 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.5.44
Cited By 2; PDF

Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling: Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2014;32(3):282-287. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.68; PDF

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging: Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2014;32(3):233-240. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.19
Cited By 2; PDF

Study on Joint of Micro Solder Bump for Application of Flexible Electronics: Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2013;31(3):4-10. Published online June 30, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.3.4
Cited By 3; PDF

Evaluation of Property and Reliability of Sn3.5Ag and Sn0.7Cu Pb-free Solder Joint by Complex Vibration for Application of Automobile Electric Module: Young-Ho Ko, Jung-Hwan Bang, Jeong-Han Kim, Chang-Woo Lee; J Weld Join. 2013;31(1):6-10. Published online June 4, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.1.6

Joint Reliability of Sn3.5Ag, Sn0.7Cu and Sn5.0Sb Pb-free Solder and Hybrids Joining Process for Application of Automobile Electric Module: Myong-Suk Kang, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2012;30(6):1-5. Published online December 23, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.6.1; PDF

Volume 42, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,572	Review on Vacuum Laser Beam Welding
4,044	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,797	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,771	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,671	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 9	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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