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J Weld Join. 2014;32(3):233-240. Published online 2014 Jun 30 DOI: https://doi.org/10.5781/JWJ.2014.32.3.19
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Citations to this article as recorded by
 Effects of interfacial layer-by-layer nanolayers on the stability of the Cu TSV: Diffusion barrier, adhesion, conformal coating, and mechanical property
Daekyun Jeong, Rahim Abdur, Young-Chang Joo, Jae-il Jang, Pil Ryung Cha, Jiyoung Kim, Kyeong-Sik Min, Jaegab Lee
Materials Science in Semiconductor Processing.2018; 83: 33. CrossRef Effect of Via Pitch on the Extrusion Behavior of Cu-filled TSV
Seho Kee, Wonjoong Kim, Jaepil Jung, Minhyung Choi
Korean Journal of Metals and Materials.2018; 56(6): 449. CrossRef
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