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Recent Progress of TGV Technology for High Performance Semiconductor Packaging: Beom Chang Seok, Jae Pil Jung; J Weld Join. 2024;42(2):155-164. Published online April 30, 2024; DOI: https://doi.org/10.5781/JWJ.2024.42.2.2; PDF

Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles: Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon; J Weld Join. 2022;40(3):233-241. Published online June 2, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.4; Full text PubReader ePub PDF

A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste: Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee; J Weld Join. 2021;39(4):376-383. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.5
Cited By 3; Full text PubReader ePub PDF

Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications: Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung; J Weld Join. 2019;37(2):7-14. Published online April 30, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.2
Cited By 15; Full text PubReader ePub PDF

Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications: Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon; J Weld Join. 2019;37(2):26-34. Published online April 22, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.5
Cited By 9; Full text PubReader ePub PDF

Epoxy solder paste and its applications: Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee; J Weld Join. 2015;33(3):32-39. Published online June 30, 2015; DOI: https://doi.org/10.5781/JWJ.2015.33.3.32
Cited By 4; PDF

Validation of sequence test method of Pb-free solder joint for automotive electronics: A Young Kim, Chul Min Oh, Won Sik Hong; J Weld Join. 2015;33(3):25-31. Published online June 30, 2015; DOI: https://doi.org/10.5781/JWJ.2015.33.3.25; PDF

Recent Progress in Flexible/Wearable Electronics: Seok Hee Kang, Suck Won Hong; J Weld Join. 2014;32(3):248-256. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.34
Cited By 3; PDF

Plasma Electrolytic Oxidation in Surface Modification of Metals for Electronics: Mukesh Kumar Sharma, Youngjoo Jang, Jongmin Kim, Hyungtae Kim, Jae Pil Jung; J Weld Join. 2014;32(3):241-247. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.27
Cited By 7; PDF

Adhesion Measurement Methods for Thin Films in Microelectronics: Taek-Soo Kim; J Weld Join. 2012;30(3):15-20. Published online July 18, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.3.15; PDF

Volume 42, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,581	Review on Vacuum Laser Beam Welding
4,053	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,803	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,782	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,671	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 9	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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