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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2022;40(3):242-247.   Published online June 14, 2022
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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2019;37(1):76-81.   Published online January 24, 2019
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2031840
Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives
Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
J Weld Join. 2017;35(3):15-20.   Published online June 30, 2017
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