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2032214
Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles
Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon
J Weld Join. 2022;40(3):233-241.   Published online June 2, 2022
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A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
J Weld Join. 2021;39(4):376-383.   Published online August 23, 2021
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Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
J Weld Join. 2019;37(2):26-34.   Published online April 22, 2019
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