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Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.
J Weld Join. 2008;26(1):31-36.   Published online March 21, 2008
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Fabrication of Solder Bump Pattern Using Thin Mold
Dong-Jin Nam, Jae-Hak Lee, Choong-Don Yoo
J Weld Join. 2007;25(2):76-81.   Published online May 17, 2007
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Low Temperature Bonding Process of Silicon and Glass using Spin-on Glass
Jae-Hak Lee, Choong-Don Yoo
J Weld Join. 2005;23(6):77-86.   Published online January 26, 2006
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Heat Source Modeling of Laser Keyhole Welding : Part 2-Effects of Gap and Thickness Difference
Jae-Young Lee, Won-Beom Lee, Choong-Don Yoo
J Weld Join. 2005;23(1):55-60.   Published online April 29, 2005
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Heat Source Modeling of Laser Keyhole Welding : Part 1-Bead Welding
Jae-Young Lee, Won-Beom Lee, Choong-Don Yoo
J Weld Join. 2005;23(1):48-54.   Published online April 29, 2005
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Longitudinal Ultrasonic Bonding of Strip-type Au Bumps
Byung-Chul Kim, Jung-Ho Kim, Ji-Hye Lee, Choong-Don Yoo, Doo-Sun Choi
J Weld Join. 2004;22(3):62-68.   Published online September 15, 2004
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Heat Source Modeling of GMAW Considering Metal Transfer
Ki-Nam Jung, Ji-Hye Lee, Jae-Young Lee, Choong-Don Yoo
J Weld Join. 2004;22(2):69-77.   Published online September 15, 2004
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