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2031740
Effect of Various Factors on the Brazed Joint Properties in Al Brazing Technology
Ashutosh Sharma, Seung Hyun Lee, Hyung Oh Ban, Young Sik Shin, Jae-Pil Jung
J Weld Join. 2016;34(2):30-35.   Published online April 30, 2016
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2031706
Influence of Various Additional Elements in Al Based Filler Alloys for Automotive and Brazing Industry
Ashutosh Sharma, Y.S. Shin, Jae-Pil Jung
J Weld Join. 2015;33(5):1-8.   Published online October 30, 2015
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2031589
TSV Filling Technology using Cu Electrodeposition
Se-Ho Kee, Ji-Oh Shin, Il-Ho Jung, Won-Joong Kim, Jae-Pil Jung
J Weld Join. 2014;32(3):225-232.   Published online June 30, 2014
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2031564
Bonding Mechanism and Strength of Metals to Ceramics
Se-Ho Kee, Jae-Pil Jung, Won-Joong Kim
J Weld Join. 2014;32(1):40-46.   Published online February 27, 2014
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Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy
Se-Ho Kee, Sang-Yoon Park, Jae-Pil Jung, Won-Joong Kim
J Weld Join. 2012;30(3):38-43.   Published online July 18, 2012
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Cu Filling into TSV and Si Dice Stacking for 3 Dimension Packaging
Myong-Hoon Roh, Sang-Yoon Park, Wonjoong Kim, Jae-Pil Jung
J Weld Join. 2011;29(3):39-44.   Published online July 7, 2011
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Cu Filling into TSV and non-PR Sn bumping for 3 Dimension Chip Packaging
Sung-Chul Hong, Wang-Gu Lee, Jun-Kyu Park, Won-Joong Kim, Jae-Pil Jung
J Weld Join. 2011;29(1):9-13.   Published online March 4, 2011
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Characteristics of Sn-1.7Bi-0.7Cu-0.6In Lead-free Solder
Ji-Ho Park, Hee-Yul Lee, Ji-Heon Jhun, Chu-Seon Cheon, Jae-Pil Jung
J Weld Join. 2008;26(5):43-48.   Published online November 12, 2008
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The Effects of Start Block and Arc Length on Melt Through and Unmelted Zone at Welding Start in High Speed Plasma Arc Welding of Thin Plate
Yong-Su Chu, Seong-Joon Hong, Jae-Pil Jung, Sang-Myung Cho
J Weld Join. 2008;26(2):92-97.   Published online June 18, 2008
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Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology
Sung-Jun Hong, Ji-Hun Jun, Jae-Pil Jung
J Weld Join. 2007;25(2):24-30.   Published online May 17, 2007
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Fabrication of Through-hole Interconnect in Si Wafer for 3D Package
Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.
J Weld Join. 2006;24(2):64-70.   Published online July 18, 2006
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3 Dimensional Packaging Technology Using Via
Sung-Jun Hong, Kyoo-Seok Kim, Norman Zhou, Jae-Pil Jung
J Weld Join. 2006;24(2):29-33.   Published online July 18, 2006
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Lower Temperature Soldering of Capacitor Using Sn-Bi Coated Sn-3.5%Ag Solder
Mi-Jin Kim, Sun-Yun Cho, Sook-Hwan Kim, Jae-Pil Jung
J Weld Join. 2005;23(3):61-67.   Published online July 15, 2005
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Packaging Technology in Electronics and 3-dimensional Stacking Packaging
Jung-Mo Kim, Jae-Pil Jung, Sook-Hwan Kim, Jai-Hyun Park
J Weld Join. 2005;23(2):23-31.   Published online May 12, 2005
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