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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers: Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim; J Weld Join. 2022;40(3):242-247. Published online June 14, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.5; Full text PubReader ePub PDF

Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive: Byung-Seung Yim, Hee Jun Youn, Jeong Il Lee, Jong-Min Kim; J Weld Join. 2020;38(2):152-157. Published online April 23, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.2.4
Cited By 3; Full text PubReader ePub PDF

Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices: Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim; J Weld Join. 2019;37(5):477-481. Published online September 19, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.5.7; Full text PubReader ePub PDF

Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers: Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim; J Weld Join. 2019;37(1):76-81. Published online January 24, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.1.10
Cited By 2; Full text PubReader ePub PDF

Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives: Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim; J Weld Join. 2017;35(3):15-20. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.3
Cited By 1; Full text PubReader ePub PDF

ACF COB Bonding Process using Thermosonic: Yong Song, Byung-Seung Yim, Jin-Sik Joung, Jong-Min Kim; J Weld Join. 2011;29(1):25-28. Published online March 4, 2011; PDF

Electrically Conductive Adhesive using Low-melting-point Alloy and Bonding Process using Them: Byung-Seung Yim, Sung-Ho Jeon, Jong-Min Kim; J Weld Join. 2009;27(3):23-31. Published online July 6, 2009; PDF

High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives: Jin-Woon Lee, SeongHyuk Lee, Jong-Min Kim; J Weld Join. 2008;26(1):44-49. Published online March 21, 2008; PDF

Flow Characteristics and Filling Time Estimation for Underfill Process: Hyung-Sub Sim, Seong-Hyuk Lee, Jong-Min Kim, Young-Eui Shin; J Weld Join. 2007;25(3):45-50. Published online July 19, 2007; PDF

Recent Advances on Conductive Adhesives in Electronic Packaging: Jong-Min Kim; J Weld Join. 2007;25(2):31-36. Published online May 17, 2007; PDF

High Density Stacking Process and Reliability of Electronic Packaging: Young-Eui Shin, Jong-Min Kim, Young-Tark Kim, Joo-Seok Kim; J Weld Join. 2006;24(2):10-16. Published online July 18, 2006; PDF

Evaluation of Pul Strengths and Fracture Modes of Solder Joints by Modified Ball Pull Testing with Protrusion Jaw: Hyoung-Il Kim, Sung-Won Han, Jong-Min Kim, Myung-Ki Choi, Young-Eui Shin; J Weld Join. 2005;23(4):34-40. Published online September 22, 2005; PDF

Research for the Micro Packaging of Diamond Electron Emitter: Seung-Mock Lee, Jong-Min Kim; J Weld Join. 2005;23(2):41-46. Published online May 12, 2005; PDF

Electrically Conductive Adhesive Bonding Technology for Microsystems Packaging: Jong-Min Kim, Seung-Mock Lee, Young-Eui Shin; J Weld Join. 2005;23(2):18-22. Published online May 12, 2005; PDF

The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model: Young-Eui Shin, Yeon-Sung Kim, Jong-Min Kim, Myun-Gi Choi; J Weld Join. 2004;22(6):36-42. Published online January 26, 2005; PDF

Volume 42, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,507	Review on Vacuum Laser Beam Welding
3,979	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,740	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,688	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,601	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 8	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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