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2032078
Effect of Underfill and Cornerfill on the 3-Point Bending Reliability of BGA Package Under Thermal Shock Test
Kyung-Yeol Kim, Haksan Jeong, Sang-Woo Kim, Jae-Oh Bang, Seung-Boo Jung
J Weld Join. 2020;38(2):145-151.   Published online April 22, 2020
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2032013
The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module
Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung
J Weld Join. 2019;37(2):1-6.   Published online April 25, 2019
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2031937
Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate
Kyung-Yeol Kim, Haksan Jeong, Woo-Ram Myung, Seung-Boo Jung
J Weld Join. 2018;36(2):14-20.   Published online April 30, 2018
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