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Development of Bonding Process Technology for MLCB Electric Components: Jahyeon Kim, Taeyoon Im, Eunjin Jo, Dongjin Kim, Won Bin Im, Yong-Ho Ko; J Weld Join. 2025;43(2):145-152. Published online April 30, 2025; DOI: https://doi.org/10.5781/JWJ.2025.43.2.4; Full text PubReader ePub PDF

Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module: Seungju Baek, Dong-Yurl Yu, Jun-Hyuk Son et al.; J Weld Join. 2020;38(4):366-373. Published online August 24, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.4.5
Cited By 1; Full text PubReader ePub PDF

A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow: Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang; J Weld Join. 2020;38(2):131-137. Published online April 28, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.2.1; Full text PubReader ePub PDF

A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy: Junhyuk Son, Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang; J Weld Join. 2018;36(3):78-82. Published online June 19, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.3.12
Cited By 2; Full text PubReader ePub PDF

Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions: Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang; J Weld Join. 2018;36(2):21-27. Published online April 30, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.2.4; Full text PubReader ePub PDF

Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints: Jeonga Kim, Yujin Park, Chul Min Oh et al.; J Weld Join. 2017;35(3):7-14. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.2; Full text PubReader ePub PDF

A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules: Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee; J Weld Join. 2015;33(3):19-24. Published online June 30, 2015; DOI: https://doi.org/10.5781/JWJ.2015.33.3.19
Cited By 1; PDF

Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling: Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2014;32(3):282-287. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.68; PDF

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging: Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2014;32(3):233-240. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.19
Cited By 2; PDF

Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module: Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee; J Weld Join. 2013;31(5):54-58. Published online November 5, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.5.54
Cited By 1; PDF

Study on Joint of Micro Solder Bump for Application of Flexible Electronics: Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2013;31(3):4-10. Published online June 30, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.3.4
Cited By 4; PDF

Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder: Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee; J Weld Join. 2011;29(6):65-70. Published online January 20, 2012; PDF

Volume 44, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

16,582	Recent Progress of TGV Technology for High Performance Semiconductor Packaging
7,641	Review on Welding Process Monitoring Based on Deep Learning using Time-Series Data
7,144	Review on Laser Welding Technology on Aluminum and Copper Dissimilar Materials for Secondary Batteries Assembly
6,889	Effects of Aging Treatment on Microstructure, Mechanical Properties, and Wear Characteristics of 17-4PH Produced by Selective Laser Melting
5,619	Review of Recent Additive Manufacturing and Welding Research with Application of Physics-Informed Neural Networks

Cited By 8	Research Trends in the Directed Energy Deposition Method of Heterogeneous Materials
Cited By 8	Recent Progress of TGV Technology for High Performance Semiconductor Packaging
Cited By 7	Review on Welding Process Monitoring Based on Deep Learning using Time-Series Data
Cited By 6	Analyzing the Influence of Welding Process Selection on Residual Stresses in Tube-to-Tubesheet Welded Joints
Cited By 5	Effect of Cr on the Hot Ductility of Austenitic Fe-Mn-Al-C Lightweight Steel

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