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Effect of Fine Silica Filler Addition on the CTE and Void Behavior of Non-conductive Paste for CoB Flip Chip Bonding
Da-Eun Lim, Da-Hoon Jung, So-Jung Lee et al.
J Weld Join. 2018;36(4):83-88.   Published online August 6, 2018
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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.
J Weld Join. 2017;35(5):38-47.   Published online September 26, 2017
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Effect of BOE Wet Etching on Interfacial Characteristics of Cu-Cu Pattern Direct Bonds for 3D-IC Integrations
Jong-Myeong Park, Su-Hyeong Kim, SarahEunkyung Kim, Young-Bae Park
J Weld Join. 2012;30(3):26-31.   Published online July 18, 2012
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Electrochemical Migration Characteristics of Sn-3.0Ag-0.5Cu Solder Alloy in NaBr and NaF Solutions
Ja-Young Jung, Eun-Jung Jang, Young-Ran Yoo et al.
J Weld Join. 2007;25(3):57-63.   Published online July 19, 2007
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