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Strength Evaluation of Welded Aluminum T-joints, as a Function of Its Welding Process, Execution, Filler Material, and Weld Root Penetration
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Prediction Model for Tensile Shear Strength of Gas Metal Arc Weld using a Laser Vision Sensor
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A Review on Effects of Weld Porosity in Laser-Arc Hybrid Welding for Aluminum Alloys
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Hot Cracking Characteristics During Single-Mode Fiber and Green Laser Welding Processes in Lithium-Ion Battery Pack Manufacturing
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Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
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Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
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A Study on the Characteristics about Shaft Deflection According to the Change in Manufacturing Sequences
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Understanding the Effects of Surface Finish on Diffusion Bonding of AZ31 Alloys
Matthew Criado, Abhijit Roy, John Ohodnicki, Nicholas Tondravi, Hannah Fischer, Alejandro Almarza, Howard A. Kuhn, Prashant N. Kumta
J Weld Join. 2023;41(5):317-326.

Research Paper

Strength Evaluation of Welded Aluminum T-joints, as a Function of Its Welding Process, Execution, Filler Material, and Weld Root Penetration
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J Weld Join. 2023;41(5):327-334.

Research Paper

A Study on Gap Bridging Formation Conditions in Butt Root Pass Welding Using GTAW
Daekyu Park, Changsub Song, Youngwhan Park
J Weld Join. 2023;41(5):335-341.

Research Paper

Effects of Welding Parameters on Droplet Transfer and Bead Geometry in Laser Welding with Aluminum and Stainless Steel Filler Wires
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J Weld Join. 2023;41(5):342-348.

Research Paper

Prediction Model for Tensile Shear Strength of Gas Metal Arc Weld using a Laser Vision Sensor
Changhoon Lee, Dong-Yoon Kim, Jason Cheon, Jiyoung Yu
J Weld Join. 2023;41(5):349-357.

Research Paper

A Review on Effects of Weld Porosity in Laser-Arc Hybrid Welding for Aluminum Alloys
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J Weld Join. 2023;41(5):358-366.

Research Paper

Hot Cracking Characteristics During Single-Mode Fiber and Green Laser Welding Processes in Lithium-Ion Battery Pack Manufacturing
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J Weld Join. 2023;41(5):367-378.

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Editors’ Choice

Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
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J Weld Join. 2023;41(5):379-386.

Research Paper

Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
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J Weld Join. 2023;41(5):387-395.

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