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Study on Joint of Micro Solder Bump for Application of Flexible Electronics
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Citations to this article as recorded by
 Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
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Journal of Welding and Joining.2022; 40(2): 165. CrossRef Microstructure and mechanical properties of indium–bismuth alloys for low melting-temperature solder
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Journal of Materials Science: Materials in Electro.2018; 29(19): 16460. CrossRef Recent Progress in Flexible/Wearable Electronics
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