 |
|
Degradation Behavior of Solder Joint and Implementation Technology for Lead-free
Automotive Electronics
Won Sik Hong, Chul Min Oh
Journal of KWJS. 2013;31(3):22-30. Published online 2013 Jun 30 DOI: https://doi.org/10.5781/KWJS.2013.31.3.22
|
|
Citations to this article as recorded by
 Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
Journal of Welding and Joining.2023; 41(4): 265. CrossRef Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
Journal of Welding and Joining.2022; 40(3): 271. CrossRef Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
Journal of Welding and Joining.2022; 40(3): 207. CrossRef Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
Journal of Welding and Joining.2019; 37(4): 363. CrossRef Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)
Jeonga Kim, Cheolho Park, Kyung-Mox Cho, Wonsik Hong, Jung-Hwan Bang, Yong-Ho Ko, Namhyun Kang
Electronic Materials Letters.2018; 14(6): 678. CrossRef Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining.2017; 35(5): 38. CrossRef Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics
Min-Soo Kang, Yu-Jae Jeon, Do-Seok Kim, Young-Eui Shin
International Journal of Precision Engineering and.2016; 17(4): 445. CrossRef Shear Strength Degradation of Pb-Free Solder Joint with Mounted Location in Automobile
Won Sik Hong, A Young Kim
MATERIALS TRANSACTIONS.2015; 56(7): 1002. CrossRef Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine
A Young Kim, Won Sik Hong
Journal of Welding and Joining.2014; 32(3): 74. CrossRef
|