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Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability
Ji-Hye Lee, Seok-Hwan Huh, Gi-Ho Jung, Suk-Jin Ham
J Weld Join. 2014;32(3):274-281. Published online 2014 Jun 30 DOI: https://doi.org/10.5781/JWJ.2014.32.3.60
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Citations to this article as recorded by
 Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module
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Journal of Welding and Joining.2020; 38(4): 366. CrossRef Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 1. Effects of thickness and roughness of electroless Ni-P deposit
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Journal of the Microelectronics and Packaging Soci.2014; 21(3): 43. CrossRef
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