 |
|
Epoxy solder paste and its applications
Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
J Weld Join. 2015;33(3):32-39. Published online 2015 Jun 30 DOI: https://doi.org/10.5781/JWJ.2015.33.3.32
|
|
Citations to this article as recorded by
 Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost
Han-Wen Hu, Yu-Wei Huang, Yi-Chieh Tsai, Meng-Kai Shih, Kuan-Neng Chen
IEEE Journal of the Electron Devices Society.2022; 10: 791. CrossRef Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
Hyejun Kang, Sri Harini Rajendran, Jae Pil Jung
Metals.2021; 11(2): 364. CrossRef Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom
Polymers.2021; 13(6): 957. CrossRef Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
Journal of Welding and Joining.2019; 37(2): 7. CrossRef
|