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Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
Mi-Song Kim, Chulmin Oh, Won Sik Hong
J Weld Join. 2019;37(2):15-20. Published online 2019 Apr 19 DOI: https://doi.org/10.5781/JWJ.2019.37.2.3
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