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Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
J Weld Join. 2019;37(2):26-34. Published online 2019 Apr 22 DOI: https://doi.org/10.5781/JWJ.2019.37.2.5
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