Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
Journal of Welding and Joining. 2019;37(2):7-14.   Published online 2019 Apr 30     DOI: https://doi.org/10.5781/JWJ.2019.37.2.2
Citations to this article as recorded by Crossref logo
Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
Hyejun Kang, Sri Harini Rajendran, Jae Pil Jung
Metals.2021; 11(2): 364.     CrossRef
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom
Polymers.2021; 13(6): 957.     CrossRef
Reliability Evaluation of Epoxy Solder Joints for Medical Electronic Devices
Yu-Jae Jeon, Min-Soo Kang
Journal of the Korean Society of Manufacturing Tec.2021; 30(2): 127.     CrossRef
Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics
Hyejun Kang, Ashutosh Sharma, Jae Pil Jung
Metals.2020; 10(7): 934.     CrossRef