Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications
Kwang-Seong Choi, Jiho Joo, Ki-seok Jang, Gwang-Mun Choi, Ho-Gyeong Yun, Seok Hwan Moon, Yong-Sung Eom
J Weld Join. 2020;38(2):138-144. Published online 2020 Apr 29 DOI: https://doi.org/10.5781/JWJ.2020.38.2.2
|
Citations to this article as recorded by
Recent progress of laser processing technology in micro-LED display manufacturing: A review
Lingxiao Song, Xuechao Yong, Peilei Zhang, Shijie Song, Kefan Chen, Hua Yan, Tianzhu Sun, Qinghua Lu, Haichuan Shi, Yu Chen, Yuze Huang
Optics & Laser Technology.2025; 181: 111710. CrossRef Recent Advences in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED
Jun Ho Ku, Jae Pil Jung
Journal of Welding and Joining.2024; 42(4): 428. CrossRef Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding
Aleksandr Andreevich Vlasov, Topi Uusitalo, Heikki Virtanen, Jukka Viheriälä, Mircea Guina
IEEE Photonics Journal.2023; 15(5): 1. CrossRef Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding
Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang
Journal of Welding and Joining.2023; 41(4): 291. CrossRef Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
Hyejun Kang, Sri Harini Rajendran, Jae Pil Jung
Metals.2021; 11(2): 364. CrossRef
|