Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
J Weld Join. 2021;39(4):343-348.   Published online 2021 Aug 11     DOI: https://doi.org/10.5781/JWJ.2021.39.4.1
Citations to this article as recorded by Crossref logo
Calculation of Mechanical Properties, Electronic Properties, and Thermodynamic Properties of AuAl Crystal: Firstā€Principles Calculation
Xujin Han, Manmen Liu, Xiaolong Zhou
Crystal Research and Technology.2023;[Epub]     CrossRef
Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring
Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, Jae Pil Jung
Metals.2021; 11(10): 1537.     CrossRef