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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174. Published online 2022 Apr 21 DOI: https://doi.org/10.5781/JWJ.2022.40.2.8
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Citations to this article as recorded by
 Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
Journal of Welding and Joining.2023; 41(4): 265. CrossRef Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
Journal of Welding and Joining.2023; 41(5): 387. CrossRef Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
Journal of Welding and Joining.2022; 40(3): 207. CrossRef
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