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Effect of Continuous Casting Parameters on Microstructure and Texture of Gold Bonding Wire for Semiconductor Packaging
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The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics
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Process and Consumable Development for Silver Wire Bonding
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Pure silver wire bonding on palladium finishing for automotive application
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The ultrasonic welding mechanism as applied to aluminium- and gold-wire bonding in microelectronics
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The ultrasonic welding mechanism as applied to aluminum- and gold-wire bonding in microelectronics
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High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil
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Assessing of Wire Bonding on Gold Plated Pads on Epoxy Mold Compound Wafer
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