| Au 스터드 범프와 Sn-3.5Ag 솔더범프로 플립칩 본딩된 접합부의 미세조직 및 기계적 특성 |
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| Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder |
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Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee |
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| Abstract |
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The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at 260℃ and 300℃ with various bonding times of 5, 10, and 20 sec. AuSn, AuSn₂ and AuSn₄ IMCs were formed at the interface of joints and (Au, Cu)?Sn? IMC was observed near Cu pad side in the joint. At bonding temperature of 260℃, AuSn₄ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of 300℃, AuSn2 IMC clusters, which were surrounded by AuSn₄ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between AuSn2 and AuSn4 IMCs regardless bonding conditions. |
| Key Words:
Au stud bump, Flip chip bonding, Interfacial reaction, Bonding strength |
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