Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties

Kim, Il-Gwon; Son, Moon-Eui; Kim, Young-Sung

doi:2014.32.5.510

J Weld Join > Volume 32(5); 2014 > Article

Research Paper

Journal of Welding and Joining 2014;32(5):510-516.
DOI: https://doi.org/10.5781/JWJ.2014.32.5.80 Published online October 30, 2014.

Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties

Il-Gwon Kim^**, Moon-Eui Son^*, Young-Sung Kim^*

Correspondence: Young-Sung Kim,
Email: youngsk@seoultech.ac.kr

Abstract

We have successfully fabricated high strengthening Cu/STS/Cu 3 layered clad metal of 70 kgf/mm2 grade for electric device lead frame, and investigated thermal effect of the mechanical and physical properties on the Cu/STS/Cu 3 layered clad metal lead frame material at different temperatures ranging from RT to 200℃. The fabricated clad metal shows a good thermal stability under 6% degrading of mechanical tensile strength and hardness change at 200℃ and also physical properties show stable thermal and electrical conductance of over 220 W/m?K and 58.44% IACS upto the 200℃. The results confirm that fabricated high strengthening Cu/STS/Cu 3 layered clad metal can be applied for the high performed electrical lead frame devices.

Key Words: High strength clad metal, Power device, Lead frame, Thermal effect, Physical property