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J Weld Join > Volume 33(3); 2015 > Article
Journal of Welding and Joining 2015;33(3):32-39.
DOI: https://doi.org/10.5781/JWJ.2015.33.3.32    Published online June 30, 2015.
Epoxy solder paste and its applications
Jong-Tae Moon*, Yong-Sung Eom**, Jong-Hyun Lee***
Correspondence:  Jong-Hyun Lee,
Email: pljh@snut.ac.kr
Abstract
With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.
Key Words: Bonding material, Solder paste, Epoxy, High reliability, Flexible electronics, Automotive electronic module


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