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JWJ > Volume 33(3); 2015 > Article
Journal of Welding and Joining 2015 June;33(3) :47-53.
Published online June 30, 2015.
doi:https://doi.org/10.5781/JWJ.2015.33.3.47
Chlorine effect on ion migration for PCBs under temperature-humidity bias test
Seok-Hwan Huh*, An-Seob Shin*
*ACI division, Samsung Electro-Mechanics, Busan 618-819, Korea
Correspondence: Seok-Hwan Huh  Email: shhuh12@gmail.com
  Published online June 30, 2015
ABSTRACT
By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test (85℃/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that CuClx were formed and grown on Cu trace during the 170℃/3hrs and that CuClx was decomposed into Cu dendrite and Cl2 gas during the 85℃/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.
Keywords: Organic PCB | Short-circuit failure mechanism | Copper | Chlorine | Thermal humidity storage
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