1. Y. Jung, D. Ryu, M. Gim, C. Kim, Y. Song, J. Kim, J. Yoon, and C. Lee, Development of Next Generation Flip Chip Interconnection Technology using Homogenized Laser-Assisted Bonding,
Proceeding Electronic Components and Technology Conference(ECTC), Las Vegas. (2016) 88–94. https://doi.org/10.1109/ECTC.2016.76
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2. S. K, . Choi, H. Lee, H. C. Bae, and Y. S. Eom, Maskless Screen Printing Technology for 20?-Pitch, 52InSn Solder Interconnections in Display Applications, Proceeding Electronic Components and Technology Conference(ECTC), Orlando. (2014) 1154–1159. https://doi.org/10.1109/ECTC.2014.6897435
3. K. S. Choi, K. J. Sung, B. O. Lim, H. C. Bae, S. Jung, J. T. Moon, and Y. S. Eom, Novel Maskless Bumping for 3D Integration,
ETRI J. 32(2) (2010) 342–344. https://doi.org/10.4218/etrij.10.0209.0396
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4. K. S. Choi, H. E. Bae, H. C. Bae, and Y. S. Eom, Novel Bumping Material for Solder-on-Pad Technology,
ETRI J. 33(4) (2011) 637–640. https://doi.org/10.4218/etrij.13.0212.0302
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5. K.J. Sung, K. -S. Choi, H. -C. Bae, Y. -H. Kwon, and Y. -S. Eom, Novel Bumping and Underfill Tech- nologies for 3D IC Integration,
ETRI J. 34(5) (2012) 706–712. https://doi.org/10.4218/etrij.12.0112.0104
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6. Y.S. Eom, J. W. Baek, J. T. Moon, J. D. Nam, and J. M. Kim, Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Con- ductive Film,
Microelectron. Eng. (2008) 85 327–331. https://doi.org/10.1016/j.mee.2007.07.005
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7. Y. S. Eom, K. S. Jang, J. T. Moon, and J. D. Nam, Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder,
ETRI J. 32(3) (2010) 414–421. https://doi.org/10.4218/etrij.10.0109.0400
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8. K. S. Choi, H. E. Bae, H. C. Bae, and Y. S. Eom, Novel Bumping Process for Solder on Pad Technology,
ETRI J. 35(2) (2013) 340–343. https://doi.org/10.4218/etrij.13.0212.0302
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9. Y. S. Eom, J. H. Son, H. E. Bae, K. S. Choi, and H. S. Choi, Optimization of Material and Process for Fine Pitch LVSoP Technology,
ETRI J. (2013) 35(4) 625–631. https://doi.org/10.4218/etrij.13.1912.0007
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10. H. C. Bae, H. Lee, K. S. Choi, and Y. S. Eom, ine- Pitch Solder on Pad Process for Microbump Intercon- nection,
ETRI J. 35(6) (2013) 1152–1155. https://doi.org/10.4218/etrij.13.0213.0284
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11. K.S. Jang, Y.S. Eom, J. -T. Moon, Y. S. Oh, and J. -D. Nam, Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing,
J. Nanosci. Nanotechnol. 9(12) (2009) 7461–7466. https://doi.org/10.1166/jnn.2009.1752
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12. Y. S. Eom, K. S. Choi, S. H. Moon, J. H. Park, J. H. Lee, and J. T. Moon, Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive,
ETRI J. 33(6) (2011) 864–870. https://doi.org/10.4218/etrij.11.0110.0520
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13. Y. S. Eom, J. H. Son, K. S. Jang, H. S. Lee, H. C. Haem, K. S. Choi, and H. S. Choi, Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for a Long Pot Life,
ETRI J. 36(3) (2014) 343–351. https://doi.org/10.4218/etrij.14.0113.0570
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14. H. Lee, Y. S. Eom, H. C. Bae, K. S. Choi, and J. H. Lee, Characterization and Estimation of Solder-on- Pad Process for Fine-Pitch Applications,
IEEE Trans. CPMT. 4(10) (2014) 1729–1738. https://doi.org/10.1109/TCPMT.2014.2354049
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15. K. S. Choi, Y. S. Eom, S. H. Moon, J. Joo, L. I. Jeong, K. Lee, J. H. Kim, H. H. Kim, G. S. Yoon, K. H. Lee, C. H. Lee, G. S. Ahn, and M. S. Shim, Enhanced Performance of Laser- Assisted Bonding with Com- pression (LABC) Compared with Thermal Compres- sion Bonding (TCB) Technology,
Proceeding Electronic Components and Technology Conference (ECTC), Las Vegas. (2019) 197–203. https://doi.org/10.1109/ECTC.2019.00037
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16. W. A. Braganca Junior, Y. S. Eom, K. S. Jang, S. H. Moon, H. C. Bae, and K. S. Choi, Collective laser-assisted bonding process for 3D TSV integration,
ETRI J. 41(3) (2019) 396–407. https://doi.org/https://doi.org/10.4218/etrij.2018-0171
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17. K. S. Choi, W. A. Braganca Junior, I. Jeong, K. S. Jang, S. H. Moon, H. C. Bae, Y. S. Eom, M. K. Cho, and S. I. Chang, Interconnection Process Laser using and Hybrid Underfill for LED Array Module on Substrate PET,
Proceeding Electronic Components and Technology Conference(ECTC), San Diego. (2018) 1561–1567. https://doi.org/10.1109/ECTC.2018.00238
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18. Y. S. Eom, K. S. Jang, J. H. Son, H. C. Bae, and K. S. Choi, Conductive adhesive with transient liquid-phase sintering technology for high-power device applications,
ETRI J. 41(6) (2019) 820–828. https://doi.org/10.4218/etrij.2018-0250
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19. A. Sharma, D. H. Jung, J. S. Cheon, and J. P. Jung, Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications,
J. Weld. Join. 37(2) (2019) 7–14. https://doi.org/10.5781/JWJ.2019.37.2.2
[CROSSREF] [PDF]
20. J. T. Moon, Y. S. Eom, and J. H. Lee, Epoxy solder paste and its applications,
J. Weld. Join. 33(3) (2015) 32–39. https://doi.org/10.5781/JWJ.2015.33.3.32
[CROSSREF] [PDF]