1. Jung Y, Ryu D, Gim M, Kim C, Song Y, Kim J, Yoon J, Lee C. Development of Next Generation Flip Chip Interconnection Technology using Homogenized Laser-Assisted Bonding.
Proceeding Electronic Components and Technology Conference(ECTC), Las Vegas. (2016), 88–94 https://doi.org/10.1109/ECTC.2016.76
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2. K S, Choi , Lee H, Bae H. C, Eom Y. S. Maskless Screen Printing Technology for 20?-Pitch, 52InSn Solder Interconnections in Display Applications. Proceeding Electronic Components and Technology Conference(ECTC), Orlando. (2014), 1154–1159 https://doi.org/10.1109/ECTC.2014.6897435
3. Choi K. S, Sung K. J, Lim B. O, Bae H. C, Jung S, Moon J. T, Eom Y. S. Novel Maskless Bumping for 3D Integration.
ETRI J. 32 (2) (2010), 342–344 https://doi.org/10.4218/etrij.10.0209.0396
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4. Choi K. S, Bae H. E, Bae H. C, Eom Y. S. Novel Bumping Material for Solder-on-Pad Technology.
ETRI J. 33 (4) (2011), 637–640 https://doi.org/10.4218/etrij.13.0212.0302
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5. Sung K.J, Choi K. -S, Bae H. -C, Kwon Y. -H, Eom Y. -S. Novel Bumping and Underfill Tech- nologies for 3D IC Integration.
ETRI J. 34 (5) (2012), 706–712 https://doi.org/10.4218/etrij.12.0112.0104
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6. Eom Y.S, Baek J. W, Moon J. T, Nam J. D, Kim J. M. Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Con- ductive Film.
Microelectron. Eng. (2008), 85 327–331 https://doi.org/10.1016/j.mee.2007.07.005
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7. Eom Y. S, Jang K. S, Moon J. T, Nam J. D. Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder.
ETRI J. 32 (3) (2010), 414–421 https://doi.org/10.4218/etrij.10.0109.0400
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8. Choi K. S, Bae H. E, Bae H. C, Eom Y. S. Novel Bumping Process for Solder on Pad Technology.
ETRI J. 35 (2) (2013), 340–343 https://doi.org/10.4218/etrij.13.0212.0302
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9. Eom Y. S, Son J. H, Bae H. E, Choi K. S, Choi H. S. Optimization of Material and Process for Fine Pitch LVSoP Technology.
ETRI J. (2013), 35 (4) 625–631 https://doi.org/10.4218/etrij.13.1912.0007
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10. Bae H. C, Lee H, Choi K. S, Eom Y. S. ine- Pitch Solder on Pad Process for Microbump Intercon- nection.
ETRI J. 35 (6) (2013), 1152–1155 https://doi.org/10.4218/etrij.13.0213.0284
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11. Jang K.S, Eom Y.S, Moon J. -T, Oh Y. S, Nam J. -D. Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing. J. Nanosci. Nanotechnol. 9 (12) (2009), 7461–7466 https://doi.org/10.1166/jnn.2009.1752
12. Eom Y. S, Choi K. S, Moon S. H, Park J. H, Lee J. H, Moon J. T. Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive.
ETRI J. 33 (6) (2011), 864–870 https://doi.org/10.4218/etrij.11.0110.0520
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13. Eom Y. S, Son J. H, Jang K. S, Lee H. S, Haem H. C, Choi K. S, Choi H. S. Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for a Long Pot Life.
ETRI J. 36 (3) (2014), 343–351 https://doi.org/10.4218/etrij.14.0113.0570
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14. Lee H, Eom Y. S, Bae H. C, Choi K. S, Lee J. H. Characterization and Estimation of Solder-on- Pad Process for Fine-Pitch Applications.
IEEE Trans. CPMT. 4 (10) (2014), 1729–1738 https://doi.org/10.1109/TCPMT.2014.2354049
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15. Choi K. S, Eom Y. S, Moon S. H, Joo J, Jeong L. I, Lee K, Kim J. H, Kim H. H, Yoon G. S, Lee K. H, Lee C. H, Ahn G. S, Shim M. S. Enhanced Performance of Laser- Assisted Bonding with Com- pression (LABC) Compared with Thermal Compres- sion Bonding (TCB) Technology. Proceeding Electronic Components and Technology Conference (ECTC), Las Vegas. (2019), 197–203 https://doi.org/10.1109/ECTC.2019.00037
16. Braganca W. A Junior, Eom Y. S, Jang K. S, Moon S. H, Bae H. C, Choi K. S. Collective laser-assisted bonding process for 3D TSV integration.
ETRI J. 41 (3) (2019), 396–407 https://doi.org/https://doi.org/10.4218/etrij.2018-0171
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17. Choi K. S, Braganca W. A Junior, Jeong I, Jang K. S, Moon S. H, Bae H. C, Eom Y. S, Cho M. K, Chang S. I. Interconnection Process Laser using and Hybrid Underfill for LED Array Module on Substrate PET.
Proceeding Electronic Components and Technology Conference(ECTC), San Diego. (2018), 1561–1567 https://doi.org/10.1109/ECTC.2018.00238
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18. Eom Y. S, Jang K. S, Son J. H, Bae H. C, Choi K. S. Conductive adhesive with transient liquid-phase sintering technology for high-power device applications.
ETRI J. 41 (6) (2019), 820–828 https://doi.org/10.4218/etrij.2018-0250
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19. Sharma A, Jung D. H, Cheon J. S, Jung J. P. Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications.
J. Weld. Join. 37 (2) (2019), 7–14 https://doi.org/10.5781/JWJ.2019.37.2.2
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20. Moon J. T, Eom Y. S, Lee J. H. Epoxy solder paste and its applications.
J. Weld. Join. 33 (3) (2015), 32–39 https://doi.org/10.5781/JWJ.2015.33.3.32
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