1. Introduction
Metals are known to have higher thermal conductivity than other materials because the effect of free electron movement is larger than the influence of phonons. According to the assumption of the classical Drude model
1,2) used to explain the heat conduction of metals, free electrons behave like gas diffusion in classical mechanics as illustrated in
Fig. 1. When electrons with high thermal energy near a heat source travel in a straight line and collide with metal cations, they transfer energy, change their direction by scattering, and travel again. They diffuse in disorder while repeating this collision-change of direction. The average distance traveled by electrons before a collision is referred to as mean free path (MFP), and the temperature increases as MFP decreases. Since electrons perform random motion, some electrons in high temperature zones transfer energy to low temperature zones while some electrons in low temperature zones also travel to high temperature zones to transfer energy. Such movement, however, does not mean that energy flows from low temperature zones to high temperature zones. A net energy always flows from high temperature zones to low temperature zones because the average active energy of electrons in high temperature zones is relatively higher than that in low temperature zones. After the Drude model, various quantum mechanical models were presented considering interactions between electrons, between electrons and defects, and between electrons and boundaries
1,2).
Fig. 1
Drude Model (electron: small circle, metal ion: large circle)
When electrons in a conductor reach the grain boundary or external surface while traveling, boundary scattering occurs. It refers to a phenomenon that reflects the wave function of electrons due to a sudden change in electronic potential. Electrons change their direction as if a ball bounces off a wall. Due to this phenomenon, it was revealed that the size of the material affects heat conduction
3). In particular, when electrons traveling inside a metal hit the external surface, surface scattering occurs and the velocity of the electrons changes with no change in their quantity as shown in
Fig. 2. Phonons also cause surface scattering despite insignificant influ- ence. Such scattering occurs in the form of total reflection (probability
p) and diffuse reflection depending on the surface condition and interference effect. After reflection, the electrons again diffuse in disorder.
Fig. 2
Surface scattering and grain boundary scattering in a typical metallic nanowire
3)
When the external boundary is under adiabatic condition, there is no heat exchange with the outside, which forms thermal symmetry with a heat flux of zero as shown in
Fig. 3. This means that the temperature gradient does not occur in a direction perpendicular to the surface near the surface. From a microscopic perspective, unlike the reflection of light from a mirror, the reflection of electrons has different incidence and reflection angles depending on the surface condition. Overall thermal energy becomes symmetrical with respect to the surface because electrons enter in random directions and also proceed in random directions after reflection. If the external boundary is not under adiabatic condition, heat exchange with the outside occurs, resulting in a temperature gradient (directionality) for which the heat flux is not zero. In particular, when the thickness is low compared to the heat input, the heat exchange by convection on the external surface has significant influence. On the other hand, when heat energy is locally given onto a plate in the case of welding or line heating and the thickness is moderately high, the cooling effect by convective heat transfer on the external surface is low at the beginning. This is attributed to the fact that the rate of conduction is much faster than that of convection. In practical applications, assuming adiabatic conditions during the initial cooling phase does not yield substantial discrepancies with experimental results.
Fig. 3
Thermal symmetry boundary condition
Research efforts to predict the size of the heat affected zone (HAZ) and the fusion zone (FZ), the peak temperature, and cooling rates after the local heating of plates, i.e., welding and line heating, have advanced since the beginning of the welding process. A simple model that has been widely utilized is the Rosenthal solution
4,5), which is expressed as equation (1). It represents the temperature distribution inside a semi-infinite solid with a point heat source on the surface. Derived from the governing equations of heat conduction, it has been widely adopted by researchers.
T : estimated temperature [°C]
T0 : initial temperature [°C]
t : time [sec]
Q : Total heat energy Q=νq [J/sec], q: effective heat flux [J/mm]
v : heat source speed [mm/sec]
k : thermal conductivity [J/mm∙sec∙°C]
r0 : radial distance from heat source center [mm], r0=r0=x2+y2+z2
α : thermal diffusivity [mm2/sec]
x,y,z : coordinates of x,y and z from heat source center [mm]
It can predict the temperature over time at a point with a distance of
r0 from the heat source. A single optimal path is considered to represent various zigzag trajectories caused by the random motion of electrons. As illustrated in
Fig. 4, the shortest distance to a point in the plate,
r0, lies along the optimal path. In the semi-infinite plate with one heat source, there exists only one optimal path to a specific point.
Fig. 4
Prediction of temperature at a point in infinite plate, x2+y2+z2
Conventional heat conduction models for a semi-infinite solid assume an infinite thickness and were designed seperately for thick and thin plates. This study aims to propose a generalized heat conduction model for metals with a finite thickness by employing the surface scattering principle of free electrons. This mathematical model builds on conventional models and calculate FZ and HAZ distribution, the peak temperature distribution, and cooling rate during welding. In addition, precau- tions during the welding process are introduced through a case study on the heat concentration caused by surface scattering.
2. Method
2.1 Temperature distribution in a finite solid
Since a finite plate has a thickness unlike an infinite plate, electrons and phonons scatter on the surface. Thus, the optimal paths from the heat source to a point include various paths by reflection. Theoretically, the number of the optimal paths can increase indefinitely. To quantify the heat conduction along these paths, this study assumed adiabatic condition in which the infinite plate was cut into the same thickness and there was no heat gain or loss on the cut surface. Since all electrons and phonons are reflected from the cut surface, the number of the optimal paths increases in proportion to the number of reflections as illustrated in
Fig. 5. This study incorporated this effect into the Rosenthal solution, and proposed a method applicable to all general thicknesses rather than semi-infinite solids.
Fig. 5
Prediction of temperature at a point in finite plate, rn=x2+y2+(z−2nh)2
The temperature distribution at a point can be calculated by substituting the distances along all the optimal paths from the heat source to the point into r0 of equation (1) and summing the temperatures calculated for each path. To apply this superposition principle, thermal properties were assumed to be independent of temperature. In the equation, the initial temperature T0 is added to the final temperature for consistency. If the shortest distance on all the optimal paths that consider reflection is defined as rn, the temperature distribution can be expressed as equation (2). For simplicity, n=0 holds when there is no reflection. When the number of reflections is even, n increases by 1 to positive infinity. When it is anodd number, n decreases by 1 to negative infinity.
rn : distance from heat source center along optimal paths [mm], rn=x2+y2+(z−2nh)2
h : plate thickness [mm](z≤h)
n = −∞...,−3,−2,−1,0,+1,+2,+3,...,+∞
f=−[1r−∞exp(−vr−∞2α)+...+1r−3exp(−vr−32α) +1r−2exp(−vr−22α)+1r−1exp(−vr−12α) +1r0exp(−vr02α)+1r1exp(−vr12α) +1r2exp(−vr22α)+1r3exp(−vr32α)+... +1r∞exp(−vr∞2α)]
For n=0, equation (2) becomes equivalent to equation (1) as the case is the same as an infinite plate with no reflective surface. As the thickness decreases, the temperature at the same position becomes higher compared to the case of an infinite plate because the shortest length
rn decreases despite the same number of reflections. This also means that MFP becomes shorter. Since manually calculating equation (2) is challenging, this study proposes an algorithm flow chart to enable fast computation as shown in
Fig. 6. Although the value of n theoretically ranges from negative infinity to positive infinity , it was set to range from -200 to 200 for both calculation efficiency and accuracy. A wider range is also possible, but it was judged to be meaningless from an engineering perspective because the temperature result changed by less than 1°C. By incrementing n from -200 to 200 and calculating each
f term, then summing these to find the temperature T, and adding the initial temperature, the final temperature distribution can be predicted. The initial temperature is the temperature of the metal before heating, so the preheating temperature or interpass temperature can be applied if in use.
Fig. 6
Flow chart of prediction algorithm for temperature distribution of a finite plate
2.2 Peak temperature of a finite plate
In the heating-cooling cycle, the moment when the temperature rise halts momentarily before cooling process represents the condition for reaching the peak temperature. The peak temperature can be determined by setting the time derivative of equation (1) to zero(
∂T/
∂t=0). It is summarized as equation (3) for an infinite plate and equation (4) for a thin plate. Since the equations are the results of previous researches
6), the solving process is omitted here.
Thick plate
Thin plate:
ρ:density[kg/mm3]
c:specific heat[J/kg°C]
Unlike the above equations, the number of the
f terms in equation (2) is theoretically infinite. Thus, differentiation to obtain the peak temperature is not feasible. The algorithm in
Fig. 6, however, enables to derive the temperature matrix at each point. Given that the heat source moves, the peak temperature distribution matrix is determined by comparing each component of the y-z matrix over the x-axis, which is the movement path of the heat source, and selecting the maximum value. The results are shown in chapter 3.
2.3 Temperature distribution on the back side of a thick finite plate
Regardless of the thickness, the back side temperature distribution of all plates can be calculated by substituting h for z in equation (2) as the z value of the bottom surface corresponds to the thickness h. Hand calculation, however, is impossible due to the need to compute the infinite series f term. If the thickness is sufficiently large, a simpler expression of the formula can be derived because most terms can be neglected. To this end, it was assumed that the first surface scattering effect on the bottom surface was the most dominant, while the effect of the subsequent reflections was insi- gnificant. Here, the sufficient thickness can be seen as a degree at which the depth of HAZ does not exceed the center of the thickness. Therefore, r0=r1=x2+y2+h2 is calculated. If n is less than -1 or greater than 2, r0 becomes very large, resulting in minimal influence on temperature. Consequently, f is simplified as equation (5) leading to the equation (6), which can be hand-calculated as with equation (1).
According to the above equations and equation (1), the bottom surface temperature of a finite plate with a sufficiently high thickness is always calculated to be twice the temperature at the same position of a semi-infinite plate. This is because thermal symmetry is formed at the bottom surface. It appears that the heat source located at a symmetrical position and the current heat source influence the bottom surface simultaneously as illustrated in
Fig. 7. From a quantum perspective, it can be understood that electrons and phonons affect the temperature both when they are incident upon and reflected from the surface.
Fig. 7
Thermal symmetry of a plate with finite thickness
However, the actual temperature is always more than twice as high because much more reflections inevitably occur in reality, which were not accounted for in the initial assumption. The temperature increment by the second reflection is calculated to be 1/9 of the first calculated temperature. The distance along the optimal path is three times the thickness in z-direction from the heat source and the peak temperature is inversely proportional to the square of the distance as in equation (3). Likewise, for the third reflection, the temperature increment is reduced by 1/25 due to five times the thickness. This is the value that cannot be neglected depending on the case. The bottom surface temperature of a thin finite plate is significantly affected by multiple reflections, it can be calculated through equation (2) and
Fig. 6.
2.3.1 Peak temperature on the back side of a thick finite plate
To predict the peak temperature on the back side during welding, substituting equation (6) into ∂T/∂t=0 yields equation (7). As described above, the peak temperature on the back side of a sufficiently thick finite plate is calculated to be more than twice as high compared to an infinite plate. When the variable h is substituted into z in equation (3), the solution to equation (7) is twice as high.
At the bottom surface (finite plate):
In the case of thin finite plate, however, the peak temperature on the bottom surface is significantly affected by multiple reflections. It can be achieved using equation (2) and
Fig. 6.
In the actual arc welding process, most plates are sufficiently thick finite plates. Therefore, the peak temperature on the back side can be calculated manually using equation (8). It is a simplified prediction formula for the peak temperature on the back side according to the material, welding conditions, and joint geometry. From equation (7) the constants along with the density and specific heat of the material were combined into the material constant C, and the heat input was separated into heat input parameters such as electric current, voltage, welding speed and heat input efficiency. Detailed input variables are listed in
Table 1. For the T-shaped joint geometry with no significant thickness difference, W was set to 0.5 by assuming that heat is distributed to the horizontal and vertical plates by 50%.
Table 1
Input variables for equation (8)
Variable |
Variable name |
Variable |
Variable name |
Variable |
Variable name |
Tmax
|
Back-side peak temperature |
I |
Welding current (A) |
h |
Thickness (mm) |
V |
Welding voltage (V) |
ν |
Speed (cpm) |
T0
|
steel plate initial temperature |
C |
Material constant |
W |
Joint geometry |
η |
Heat input efficiency |
Steel: 777.3 Aluminum: 1131.4 Stainless Steel: 702.6 |
Bead on plate: 1 T-joint: 0.5 |
FCAW(CO2):0.85 SAW(automatic): 1 GTAW(TIG): 0.7 |
2.3.2 Back-side peak temperature measurement experiment
An experiment was carreid out to verify equation (8) above.
Fig. 8(a) shows the experimental specimen. For the T-shaped geometry, multipass partial penetration welding was underwent with flux cored arc welding (FCAW). The heat input of 220A, 22V, and 20cm/min was applied for the first pass while the heat input of 290A, 26V, and 35cm/min was used for the second to fifth passes. The environment was controlled to minimize the heat loss by air-induced convection or contact with other materials. As shown in
Fig. 8(b), a thermocouple was attached to the center of the bottom surface to measure the temperature over time. To compare the bottom surface temperature under the constant thickness condition, the temperature increments during the first, second, and fourth passes, which correspond to the first layer, were considered.
Fig. 8
Experiment for temperature measurement at the bottom of finite T-shaped plate