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Journal of KWJS 2002;20(1):97-102.
Published online February 25, 2002.
등온시효에 따른 Sn-3.5Ag 솔더 접합부의 금속간 화합물 성장에 관한 연구
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Growth Kinetics of Intermetallic Compound on Sn-3.5Ag/Cu, Ni Pad Solder Joint with Isothermal Aging
이인영, 이창배, 정승부, 서창제
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