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JWJ > Volume 23(6); 2005 > Article
Journal of KWJS 2005 December;23(6) :77-86.
Published online January 26, 2006.
Low Temperature Bonding Process of Silicon and Glass using Spin-on Glass
Jae-Hak Lee, Choong-Don Yoo

Correspondence:   Published online January 26, 2006
ABSTRACT
Low temperature bonding of the silicon and glass using the Spin-on Glass (SOG) has been conducted experimentally to figure out the effects of the SOG solution composition and process variables on bond strength using the Design of Experiment method. In order to achieve the high quality bond interface without crack, sufficient reaction time of the optimal SOG solution composition is needed along with proper pressure and annealing temperature. The shear strength under the optimal SOG solution composition and process condition was higher than that of conventional anodic bonding and similar to that of wafer direct bonding.
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