| 유사 조성의 모재분말과 Ni기 삽입금속 혼합분말을 사용한 천이액상확산 접합 시 모재의 용해현상 |
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| Dissolution Phenomenon of the Base Metal during TLP Bonding Using the Modified Base Metal Powder and Ni Base Filler Metal Powder |
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Woo-young Song, Chang-ho Ye, Chung-yun Kang |
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| Abstract |
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The dissolution phenomenon of the solid phase powder and base metal by liquid phase insert metal during Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111(base metal) powder and the GNi3 (Ni-14Cr-9.5Co-3.5Al-2.5B) powder was investigated. In case of the mixed powder contains modified GTD111 powder 50wt%, all of the powder was melted by liquid phase at 1423K. At the temperature between solidus and liquidus of GNi3, liquid phase penetrated into the boundary of the modified GTD111 powder and solid particle separated from powder was melted easily because area of reaction was increased. With increasing mixing ratio of the modified GTD111, it needed the higher temperature to melt all of the modified GTD111 powder. During Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111 50wt% and GNi3 50wt% as insert metal, width of the bonded interlayer was increased with increasing bonding temperature by reaction of the base metal and liquid phase in insert metal. Dissolution of the base metal and modified powder by liquid phase progressed all together and after all of the powder was melted nearly, the dissolution of the base metal occurred quickly. |
| Key Words:
Transient liquid phase bonding, Directionally solidified Ni base superalloy, GTD111, Filler metal, Wide-Gap brazing, Powder, Microstructure, Dissolution, dendrite, boundary |
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