Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Fram |
Young-Sung Kim1, Il-Gwon Kim2 |
Correspondence:
Young-Sung Kim, Email: youngsk@seoultech.ac.kr |
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Abstract |
We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to 200℃. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 Kg/mm2 to the 150℃ and 270 W/m?K to the 200℃, respectively. This clad metal lead frame material at a high temperature of 150℃ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials. |
Key Words:
Clad metal, LED lead frame, Thermal stability, Thermal conductivity |
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