Mechanical Bonding Properties of Solderable Anisotropic Polymer Composite containing Low-Melting-Point and High-Melting-Point Solder Fillers

Ha, Yi Hyeon; Jung, Myeong Jin; Park, Jong-Moon; Choi, Sung Woo; Kim, Jong-Min; Yim, Byung-Seung

doi:2024.42.2.149

J Weld Join > Volume 42(2); 2024 > Article

Research Paper

Journal of Welding and Joining 2024;42(2):149-154.
DOI: https://doi.org/10.5781/JWJ.2024.42.2.1 Published online April 30, 2024.

저융점/고융점 혼합 솔더 필러 함유 Solderable 이방성 고분자 복합 재료의 기계적 접합 특성

하이현¹

¹중앙대학교 공과대학 기계공학부
²강원대학교 공학대학 기계시스템공학부

Mechanical Bonding Properties of Solderable Anisotropic Polymer Composite containing Low-Melting-Point and High-Melting-Point Solder Fillers

Yi Hyeon Ha¹

¹School of Mechanical Engineering, Chung-Ang University, Seoul, 06974, Korea
²School of Mechanical System Engineering, Kangwon National University, Gangwon, 25913, Korea

Correspondence: Jong-Min Kim,
Email: 0326kjm@cau.ac.kr
Byung-Seung Yim,
Email: bsyim@kangwon.ac.kr

Received: 6 March 2024 • Revised: 15 March 2024 • Accepted: 20 March 2024

Abstract

In this papers, to enhance the mechanical bonding properties of solderable anisotropic polymer composites (SAPCs) containing low-melting-point solder filler only, a new low-melting-point solder and high-melting-point solder mixed filler filled SAPCs (LH-SAPCs) was proposed, and the influence of the high-melting-point solder filler on the conduction path formation and mechanical bonding properties of the LH-SAPC were investigated. Two types of LH-SAPC were synthesized by adding high-melting-point solder within the low-melting-point solder/high-melting-point solder mixed filler at mixing ratios of 0 and 50 vol% (the volume fraction of low-melting-point solder/high-melting-point solder mixed filler in the polymer composite was 20%), and a bonding test was conducted using QFP. The results exhibited that the LH-SAPC containing high-melting-point solder formed a wide and stable conduction path due to the proper selective conduction path formation behavior by the interaction between molten low-melting-point solder and solid-state high-melting-point solder fillers within the polymer composite with low viscosity condition. Furthermore, the mechanical bonding properties of the LH-SAPC joints containing high-melting-point solder were enhanced compared to that of LH-SAPC containing low-melting-point solder only owing to the precipitation hardening and dispersion strengthening effects due to the increase of fine Bi-rich, Cu₆Sn₅, and Ag₃Sn intermetallic compound particles inside the conduction path.

Key Words: Bonding property, Electrically conductive adhesive (ECA), High-melting-point solder, Low-melting-point solder, Polymer composites