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Journal of KWJS 2005;23(2):18-22.
Published online May 12, 2005.
[특집:전자패키징 기술 동향]마이크로시스템 패키징에서의 도전성 접착제 접속 기술
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Electrically Conductive Adhesive Bonding Technology for Microsystems Packaging
Jong-Min Kim, Seung-Mock Lee, Young-Eui Shin
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