Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging

Yoon, Jeong-Won; Kim, Jong-Woong; Koo, Ja-Myeong; Noh, Bo-In; Jung, Seung-Boo

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Journal of KWJS 2008;26(1):37-43.
Published online March 21, 2008.

Optoelectronic 패키징을 위한 Au-Sn 플립칩 범핑 기술과 신뢰성

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Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging

Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung

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