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Journal of KWJS 2004;22(3):62-68.
Published online September 15, 2004.
[연구논문] 스트립 형상인 Au 범프의 종방향 초음파 접합
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Longitudinal Ultrasonic Bonding of Strip-type Au Bumps
Byung-Chul Kim, Jung-Ho Kim, Ji-Hye Lee, Choong-Don Yoo, Doo-Sun Choi
Abstract
The strip Au bumps are bonded using longitudinal ultrasonic for the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the tinite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are detormed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.
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