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Journal of KWJS 2007;25(2):24-30.
Published online May 17, 2007.
3차원 패키지를 위한 관통 홀 형성과 Cu 충전
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Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology
Sung-Jun Hong, Ji-Hun Jun, Jae-Pil Jung
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