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2032177
Comparative Study on Mechanical Joints of Aluminum Vibration Damping Sheet and 1.5 GPa HPF Steel sheet
Jin Hyeok Joo, Keong Hwan Cho, Je Hoon Oh, Dong Hyuck Kam
J Weld Join. 2021;39(5):489-496.   Published online October 20, 2021
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2032180
Resistance Spot Weldability of Aluminum Alloy with 6 wt.% Magnesium
Mingyu Kim, Sehyeon Kim, Insung Hwang et al.
J Weld Join. 2021;39(5):480-488.   Published online October 27, 2021
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2032179
Weldability Evaluation of GMAW and GTAW for Al-6.7 wt.% Mg Alloy
Taehoon Kang, Jiyoung YU, Young-Min Kim, Insung Hwang, Seung Hwan Lee, Dong-Yoon Kim
J Weld Join. 2021;39(5):471-479.   Published online October 25, 2021
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2032175
Convolutional Neural Network Model for the Prediction of Back-Bead Occurrence in GMA Root Pass Welding of V-groove Butt Joint
Hyung Won Lee, Jiyoung Yu, Gwang-Gook Kim et al.
J Weld Join. 2021;39(5):463-470.   Published online October 19, 2021
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A Study on the Optimization of Welding Conditions for Titanium Drums Using GPS
Won-Bin Oh, Ill-Soo Kim, Tae-Jong Yun et al.
J Weld Join. 2021;39(4):419-426.   Published online August 23, 2021
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Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer
Da-In Lim, So-Jeong Lee, Seung-Boo Jung, Jun-Ki Kim
J Weld Join. 2021;39(4):402-408.   Published online August 23, 2021
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Penetration Depth Modeling and Process Parameter Maps for Laser Welds Using Machine Learning
Bum-su Go, Hyeonjeong You, Hee-seon Bang, Cheolhee Kim
J Weld Join. 2021;39(4):392-401.   Published online August 11, 2021
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A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
J Weld Join. 2021;39(4):376-383.   Published online August 23, 2021
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2032166
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.   Published online August 26, 2021
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2032163
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online August 23, 2021
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2032158
MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
Won Sik Hong, Mi-Song KIm, Myeongin Kim
J Weld Join. 2021;39(4):349-358.   Published online August 11, 2021
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2032157
Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
J Weld Join. 2021;39(4):343-348.   Published online August 11, 2021
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Numerical Study on Effect of the Building Height and Material Properties on Thermal Distortion of Large Cylinders Manufactured through Laser Powder Bed Fusion
Seulbi Lee, Tae Yang Bang, Woojong Kim, Mincheol Kang, Yoon Suk Choi
J Weld Join. 2021;39(3):304-313.   Published online June 8, 2021
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Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
Do Hoon Cho, Hye Jun Kang, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung
J Weld Join. 2021;39(3):295-303.   Published online May 17, 2021
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Evaluating the Welding Pulses of Various Tool Profiles in Single-Pass Friction Stir Welding of 6082-T6 Aluminium Alloy
S. Gopi, Dhanesh G Mohan
J Weld Join. 2021;39(3):284-294.   Published online June 8, 2021
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