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High-Speed Thermo-Compression Sinter-Bonding Properties in Air of a Paste Containing Dendritic Cu Particles Having Oxalate Skins: Horyun Kim, Jong-Hyun Lee; J Weld Join. 2024;42(2):184-192. Published online April 30, 2024; DOI: https://doi.org/10.5781/JWJ.2024.42.2.5; Full text PubReader ePub PDF

Optimization of TLPS Bonding Process and Joint Property using Ni-Sn Paste for High Temperature Power Module Applications: Da-Gyeong Han, Dong-Hwan Lee, Jeong-Won Yoon; J Weld Join. 2024;42(2):165-173. Published online April 30, 2024; DOI: https://doi.org/10.5781/JWJ.2024.42.2.3; Full text PubReader ePub PDF

Mechanical Bonding Properties of Solderable Anisotropic Polymer Composite containing Low-Melting-Point and High-Melting-Point Solder Fillers: Yi Hyeon Ha, Myeong Jin Jung, Jong-Moon Park, Sung Woo Choi, Jong-Min Kim, Byung-Seung Yim; J Weld Join. 2024;42(2):149-154. Published online April 30, 2024; DOI: https://doi.org/10.5781/JWJ.2024.42.2.1; Full text PubReader ePub PDF

Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes: So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong; J Weld Join. 2023;41(5):387-395. Published online October 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.5.9; Full text PubReader ePub PDF

Understanding the Effects of Surface Finish on Diffusion Bonding of AZ31 Alloys: Matthew Criado, Abhijit Roy, John Ohodnicki et al.; J Weld Join. 2023;41(5):317-326. Published online October 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.5.1; Full text PubReader ePub PDF

Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding: Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang; J Weld Join. 2023;41(4):291-298. Published online August 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.4.8; Full text PubReader ePub PDF

A Study on Aging Fracture Behavior of Sintered Joint by Bi-Modal Cu Paste: Junhyuk Son, Chang-Woo Lee, Dong-Yurl Yu, Dongjin Byun, Junghwan Bang; J Weld Join. 2022;40(6):540-546. Published online December 30, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.6.10; Full text PubReader ePub PDF

Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression: Doyeop Namgoong, Jong-Hyun Lee; J Weld Join. 2022;40(3):248-255. Published online June 14, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.6; Full text PubReader ePub PDF

Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles: Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon; J Weld Join. 2022;40(3):233-241. Published online June 2, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.4
Cited By 1; Full text PubReader ePub PDF

Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste: Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong; J Weld Join. 2022;40(2):165-174. Published online April 21, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.2.8
Cited By 4; Full text PubReader ePub PDF

A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste: Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee; J Weld Join. 2021;39(4):376-383. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.5
Cited By 3; Full text PubReader ePub PDF

Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging: Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon; J Weld Join. 2021;39(4):343-348. Published online August 11, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.1
Cited By 3; Full text PubReader ePub PDF

Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module: Seungju Baek, Dong-Yurl Yu, Jun-Hyuk Son et al.; J Weld Join. 2020;38(4):366-373. Published online August 24, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.4.5
Cited By 1; Full text PubReader ePub PDF

Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors: Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang; J Weld Join. 2020;38(2):158-165. Published online April 29, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.2.5
Cited By 1; Full text PubReader ePub PDF

Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications: Kwang-Seong Choi, Jiho Joo, Ki-seok Jang et al.; J Weld Join. 2020;38(2):138-144. Published online April 29, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.2.2
Cited By 3; Full text PubReader ePub PDF

Volume 42, No. 2

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

8,058	Review on Vacuum Laser Beam Welding
4,388	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
4,159	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
4,150	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
4,002	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 9	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 7	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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