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2032327
Recent Progress of TGV Technology for High Performance Semiconductor Packaging
Beom Chang Seok, Jae Pil Jung
J Weld Join. 2024;42(2):155-164.   Published online April 30, 2024
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2031589
TSV Filling Technology using Cu Electrodeposition
Se-Ho Kee, Ji-Oh Shin, Il-Ho Jung, Won-Joong Kim, Jae-Pil Jung
J Weld Join. 2014;32(3):225-232.   Published online June 30, 2014
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Fabrication of Through-hole Interconnect in Si Wafer for 3D Package
Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.
J Weld Join. 2006;24(2):64-70.   Published online July 18, 2006
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