- Research Papers Recent Progress of TGV Technology for High Performance Semiconductor Packaging
- Beom Chang Seok, Jae Pil Jung
- J Weld Join. 2024;42(2):155-164.
- Review Papers A Review of the Brazeability of Low-Temperature and Nano-Reinforced Al-Based Brazing Filler Metals
- Furkan, Hye-Jeong Kim, Gun-hwan Lee, Jae Pil Jung
- J Weld Join. 2022;40(3):216-224.
- Review Papers Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
- Do Hoon Cho, Hye Jun Kang, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung
- J Weld Join. 2021;39(3):295-303.
- Review Paper Recent Low Temperature Solder of SnBi and Its Bonding Characteristics
- Hyejun Kang, Bumgyu Baek, Jae Pil Jung
- J Weld Join. 2020;38(6):576-583.
- Review Papers Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
- Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung
- J Weld Join. 2019;37(2):7-14.
- Special Issues Brazing Filler Metal and Process for Stainless Steel
- Sung Chul Hong, Sang Yoon Park, Do Hyun Jung, Joo Hee Oh, Jae Hoon Lee, Wonjoong Kim, Jae Pil Jung
- Journal of KWJS. 2012;30(6):15-20.
- Special Issues Plasma Electrolytic Oxidation in Surface Modification of Metals for Electronics
- Mukesh Kumar Sharma, Youngjoo Jang, Jongmin Kim, Hyungtae Kim, Jae Pil Jung
- J Weld Join. 2014;32(3):241-247.
- Special Issues Various Cu Filling Methods of TSV for Three Dimensional Packaging
- Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jae Pil Jung, Hyeong-Tea Kim
- Journal of KWJS. 2013;31(3):11-16.