- Research Papers Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive
- Byung-Seung Yim, Hee Jun Youn, Jeong Il Lee, Jong-Min Kim
- J Weld Join. 2020;38(2):152-157.
- Research Papers Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
- Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
- J Weld Join. 2019;37(1):76-81.
- Research Papers Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives
- Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
- J Weld Join. 2017;35(3):15-20.