- Research Papers Lifetime Predictions of Printed Circuit Boards under Biased HAST
- Seok-Hwan Huh
- J Weld Join. 2018;36(2):1-6.
- Research Papers Chlorine effect on ion migration for PCBs under temperature-humidity bias test
- Seok-Hwan Huh, An-Seob Shin
- J Weld Join. 2015;33(3):47-53.
- Research Papers Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability
- Ji-Hye Lee, Seok-Hwan Huh, Gi-Ho Jung, Suk-Jin Ham
- J Weld Join. 2014;32(3):274-281.
- Interfacial Microstructures between Ag Wiring Layers and Various Substrates
- Keun-Soo Kim, K. Suganuma, Seok-Hwan Huh
- Journal of KWJS. 2011;29(5):90-94.
- Development of Sn-Zn Based Low Temperature Lead-Free Solder for Improvement of Oxidation Resistance
- Jae-Ean Lee, Keun-Soo Kim, Seok-Hwan Huh
- Journal of KWJS. 2011;29(5):16-23.