- Review Papers Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
- Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
- J Weld Join. 2021;39(1):89-102.
- Verification Guideline of Pb-free Solder Joint Reliability for Military Electronics
- WonSik Hong, Gi-Young Goo, UnHee Hwang
- Journal of KWJS. 2012;30(3):44-50.
- Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
- Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong
- Journal of KWJS. 2012;30(2):65-69.
- Relaibility Validation Methodology for Implementation Pb-free Solder to Military Electronics
- Jaesseong Jeong, Chulmin Oh, Gi-Young Goo, Young-Ho Yoon, UnHee Hwang, WonSik Hong
- Journal of KWJS. 2011;29(4):11-20.
- The Growth Mechanism and Mitigation Method of Sn Whiskers
- Chulmin Oh, JaeSung Jung, ki-Young Ku, Young-Ho Yoon, UnHee Hwang, WonSik Hong
- Journal of KWJS. 2011;29(4):3-10.
- PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development
- WonSik Hong, Chul-Min Oh
- Journal of KWJS. 2009;27(3):10-16.