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J Weld Join. 2014;32(5):510-516. Published online October 30, 2014.
DOI: https://doi.org/10.5781/JWJ.2014.32.5.80
- Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties
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Il-Gwon Kim**, Moon-Eui Son*, Young-Sung Kim*
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- Corresponding author: Young-Sung Kim ,Email: youngsk@seoultech.ac.kr
- Abstract
- We have successfully fabricated high strengthening Cu/STS/Cu 3 layered clad metal of 70 kgf/mm2 grade for electric device lead frame, and investigated thermal effect of the mechanical and physical properties on the Cu/STS/Cu 3 layered clad metal lead frame material at different temperatures ranging from RT to 200℃. The fabricated clad metal shows a good thermal stability under 6% degrading of mechanical tensile strength and hardness change at 200℃ and also physical properties show stable thermal and electrical conductance of over 220 W/m?K and 58.44% IACS upto the 200℃. The results confirm that fabricated high strengthening Cu/STS/Cu 3 layered clad metal can be applied for the high performed electrical lead frame devices.
Keywords :High strength clad metal, Power device, Lead frame, Thermal effect, Physical property
