Warning: fopen(/home/virtual/kwjs/journal/upload/ip_log/ip_log_2024-05.txt): failed to open stream: Permission denied in /home/virtual/lib/view_data.php on line 88
Warning: fwrite() expects parameter 1 to be resource, boolean given in /home/virtual/lib/view_data.php on line 89
-
-
Journal of KWJS. 2001;19(4):44-50. Published online August 27, 2001.
- Thermal Fatigue Life Prediction of μBGA Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead-free Solder
-
신영의, 이준환, 하범용, 정승부, 정재필
-
