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2032250
Effect of Process Parameters and Nugget Growth Rate on Liquid Metal Embrittlement (LME) Cracking in the Resistance Spot Welding of Zinc-Coated Steels (Editors’ Choice)
WooSung Jin, Arun Lalachan, Siva Prasad Murugan, Changwook Ji, Yeong-do Park
J Weld Join. 2022;40(6):464-477.   Published online December 30, 2022
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2032219
Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
Doyeop Namgoong, Jong-Hyun Lee
J Weld Join. 2022;40(3):248-255.   Published online June 14, 2022
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2032123
A Study of Brittle Crack Arrestability Test Method
Gyubaek An, Hong-Yeol Bae, Jeong-Ung Park
J Weld Join. 2020;38(6):535-542.   Published online December 29, 2020
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Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors
Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang
J Weld Join. 2020;38(2):158-165.   Published online April 29, 2020
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Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices
Na Yeon Lee, Jong-Hyun Lee, Chang-Yong Hyun
J Weld Join. 2019;37(5):482-492.   Published online October 4, 2019
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Parametric Study of Self-Piercing Riveting for CFRP-Aluminum Dissimilar Joint
Nam-Ki Jeon, Sehun Rhee, Dong-Hyuck Kam
J Weld Join. 2018;36(3):8-17.   Published online June 4, 2018
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Microstructure and Hardness of Surface Melting Hardened Zone of Mold Steel, SM45C using Yb:YAG Disk Laser
Kwang-Hyeon Lee, Seong-Won Choi, Tae-Jin Yoon, Chung-Yun Kang
J Weld Join. 2016;34(1):75-81.   Published online February 29, 2016
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2031715
Microstructure and Hardness of Yb:YAG Disc Laser Surface Overlap Melted Cold Die Steel, STD11
Kwang-Hyeon Lee, Seong-Won Choi, Jung Gil Yun, Myeong-Hwan Oh, Byung Min Kim, Chung-Yun Kang
J Weld Join. 2015;33(5):53-60.   Published online October 30, 2015
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2031713
Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding
Kyung-Eun Min, Jun-Sik Lee, So-Jeong Lee, Sung Yi, Jun-Ki Kim
J Weld Join. 2015;33(5):41-46.   Published online October 30, 2015
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2031550
Fracture Mode Analysis with ISB Bonding Process Parameter for 3D Packaging
Young-Kang Lee , Jae-Hak Lee , Jun-Yeob Song , Hyoung-Joon Kim
J Weld Join. 2013;31(6):77-83.   Published online January 21, 2014
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2031503
Study on Joint of Micro Solder Bump for Application of Flexible Electronics
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
J Weld Join. 2013;31(3):4-10.   Published online June 30, 2013
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